SpectroScan 3D
The SpectroScan 3D is a range MEMS Scanned Laser Ranging and Imaging System. The unit
scans with an eye‐safe 1550nm laser in short wave infrared operation, making it ideal for
outdoor and indoor applications. It’s compact design and passive cooling lends itself to robotic
or autonomous applications. The SpectroScan 3D LIDAR System includes easy to use 3D
visualization and configuration PC software for real time ranging and 3D modeling.

InGaAs / P-I-N 10Gb die 

Spectrolab’s Telcordia qualified InGaAs P-I-N photodetectors are offered in die form for 10Gb/s telecommunication applications.

InGaAs / P-I-N 2.5Gb die

Spectrolab’s Telcordia qualified InGaAs P-I-N Photodetector device dies are offered for the telecommunication market.  The dies have planer design and are front-illuminated.  The combination of low dark current and capacitance of these dies provide high receiver sensitivity. 

InGaAs / APD 200 micron die

Spectrolab’s 200 micron diameter Avalanche Photodetector Die is built on using low-noise InAlAs/InGaAs device design. These are front illuminated mesa design and offer low dark current and low-noise hence, well suited for long range laser rangefinder applications.

InGaAs / InAlAs APD 2.5Gb die

Spectrolab’s 75 micron diameter Avalanche Photodetector Die is built on using low-noise InAlAs/InGaAs device design. These are front illuminated mesa design and offer low dark current and low-noise hence, well suited for long range fiber optic communication applications.

2V Dual-junction GaAs Power Converter

Spectrolab’s Monolithic Power-by-Fiber GaAs dual-junction power converter offers high conversion efficiency of 50 – 55% over variety of input power levels for the 810 nm laser wavelength.  The device is available in die form or packaged in TO can packages with FC and ST connectors.  Single and multi-mode fiber assembly packages are also available.

6V multijunction 810 nm laser power converter die

Spectrolab’s 6V GaAs Dual Junction laser power converter dies offer nominal 30-35% conversion efficiency over variety of input power levels for the 810 nm laser wavelength.   These devices are available in die form or packaged in TO packages with FC and ST connectors.