sensors

Spectrolab offers high performance and reliable sensor products for the fiber-optic communications, photon counting, and infrared imaging markets.  Device structures are grown by metal organic chemical vapor epitaxy (MOVPE) in production scale multi-wafer reactors. Devices are fabricated using our state of the art fabrication facility. We offer a variety of standard packaging options and as well as custom design packages.

Sensor products include photo detectors and laser power converters. Photodetectors operate in the short wavelength infrared (SWIR) region (900 to 1600 nm) and laser power converters are designed to operate at 800 – 820 nm and 1050 – 1060 nm wavelengths. We offer, single element devices, detector arrays, packaged detectors, focal plane arrays, sensor chip assemblies and cameras.

InGaAs PIN Products

• InGaAs P-I-N 10Gb die
• InGaAs P-I-N 2.5Gb die
• InGaAs P-I-N Monitor die
• Low-noise InGaAs PIN arrays (640 x 512, 1024 x 1280)

For InGaAs PIN arrays and any custom design packages,

please contact us.

InGaAs APD Products

• InGaAs/InAlAs APD 10Gb die
• InGaAs/InAlAs APD 2.5Gb die
• InGaAs/InAlAs APD 200 micron die
• InGaAs/InAlAs APD 300 micron die
• InGaAs/InAlAs APD 1 mm die
• Low-noise InGaAs/InAlAs APD receiver
• InGaAs/InAlAs linear-mode detector arrays
• InGaAs/InP Geiger-mode APD dies (different sizes)
• InGaAs/InP Geiger-mode APD arrays
• InGaAs/InP Geiger-mode 32 x 32 APD sensor chip assembly
• InGaAs/InP 32 x 32 Geiger-mode APD camera

InGaAs PIN and APD array products are ITAR controlled,

please contact us.

Laser Power Converter Products

• GaAs 2V multijunction 810 nm laser power converter die
• GaAs 6V multijunction 810 nm laser power converter die
• GaInAs 2V 1060 nm laser power converter die

For packaged laser power converter products, large-area chips, and custom panel assembly products,

please contact us.

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