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Products - Services - Device Processing Foundry Services - Thermal CVD Processes 
LPCVD equipment is designed for batch processing to manufacture wafer "lots" of up to 100 4-inch wafers per run per tube. Most systems possess multiple (4) deposition tubes.
     • Low temperature oxide 
       (LTO ~450C) deposition on 
       compound semiconductors 
      (GaAs/InP)
     • High temperature Si3N4  
       (~800-1000C) deposition on silicon 
       wafers - for passivation, masking,  
       and protective coatings


Multiple deposition tube LPCVD equipment