| Spectrolab operates a world-class packaging laboratory for prototype assembly and test. The engineers
of the packaging team will work with you to custom design photodiodes, and laser fiber packages to
meet your specific needs. We have the capability to inspect and test the package during and after assembly
to meet the Bellcore standards. Finally, Spectrolab has state-of-the-art modeling tools and the expertise to perform thermal,
mechanical, vibration and optical analysis.
Spectrolabs state-of-the-art packaging laboratory includes the following equipment:
Die Attach Equipment:
Manual epoxy die attach
Oven for temperature curing of epoxy
UV curable adhesives dispense system with the UV lamp for primary cure and UV oven
for final cure
Manual eutectic die bonder for installation of components using alloy material
Wire Bonding Equipment:
Manual wire bonder for quick evaluation and process development
Semi-automatic wire bonder for volume production
Wire pull tester for inspecting the quality of the wire bonding
Fiber Coupling Equipment:
Laminar flow hood to provide a low particle environment work area
Cleaver for cutting fibers in 0 to 16°
Microscope for visual inspection of fibers
Interferometer for mapping of fiber terminations
Splicer for fiber splicing and lens formation
Spectrolab employs the latest techniques used for fiber alignment. One technique uses a
basic fiber alignment system for fiber alignments with a wide range of alignment tolerance.
Another technique uses high-precision fiber alignment system for alignment of fibers requiring
high accuracy and narrow tolerance like SM fibers. A pigtail soldering system is used to achieve
hermetic soldering of fiber providing input and output for optoelectronic packages.
Hermetic Sealing Equipment:
Seam sealer for sealing of rectangular packages
Cap welder for sealing of round (TO-type) packages
Capability to check the hermeticity of the package via a pressurization system for
forcing gas into packages (to prepare them for leak testing)
Gross leak tester for detection of large leaks
Fine leak tester for detection and measurement of small leaks
Cleaning Equipment:
Solvent cleaning station for cleaning of unassembled components and packages
Spray cleaner for cleaning of assemblies and optical components
Plasma cleaner for fine cleaning prior to critical processes such as wire bonding
Measurement and Quality Inspection Equipment:
Stereo zoom inspection microscopes for in-process viewing of assemblies
Optical comparator for passive alignment and dimensional verification of components
and assemblies
High power measuring microscope for high magnification inspection and measuring of
critical component features
Temperature cycle chamber used to expose parts to temperature extremes similar to
the actual application
Centrifuge used to expose parts to constant acceleration in order to reveal possible
failures in actual environment
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